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The Burn in Oven is designed to accelerate the failure rate of early life defects in electronic components and systems. This oven is engineered to simulate high-temp conditions, ensuring that only the most reliable products make it to market. Usually the samples are burned and tested under ovens at constant temperature around 100°C to 125°C.
Application:
Electronic devices, ICs and miscellaneous other semiconductor devices
Testing Standards:
IEC 60068-2-1: 2007, IEC 60068-2-2: 2007, IEC 60068-2-14: 2009, GB/T 11158: 2008, GB/T 2423.2: 2008, GB/T 30435: 2013.
Features:
Highly customized oven design according to specific user requirements
Multi safety protection
Uniform air circulation across chamber
Technical Parameters:
| Model | SZ-BIO-12C | SZ-BIO-24C | SZ-BIO-36C | SZ-BIO-48C | SZ-BIO-78C |
| BIB slots | 12 BIB slots | 24 BIB slots | 36 BIB slots | 48 BIB slots | 78 BIB slots |
| Size | Customized as per testing requirement | ||||
| Temperature range | RT+20℃～+200℃ | ||||
| Temperature fluctuation | ±0.5℃ | ||||
| Temperature deviation | ≤±2℃ | ||||
| Temperature uniformity | ≤±2℃ | ||||
| Heating rate | RT→+200℃≤25min | ||||
| Cooling rate | 200℃→50℃≤30min (fast cooling designed to save waiting time and improve fab productivity) | ||||
| Our strength | Highly customized oven design according to specific user needs catering to BIB, feed through, backplane and driver board dimensions.
Full range of sensors equipped (over-temperature protector in multiple spots, under-temperature sensor, airflow meter, air pressure differential sensor, interlock sensor etc.) |
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| Optional | Additional built-in refrigeration unit to provide minus temperature conditions to fulfill HTOL and LTOL test requirements. | ||||
With 19 years of history, GAAT has been established as a global manufacturer and exporter in the R&D, production and sales of environmental test chambers.
Email: sales@gaat-equipment.com
Phone: +86-15622955621
